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SMT/HYBRID/PACKAGING 2009, Nuremberg, Germany

By Elcoteq Communications | May 12, 2009

00569480001208849796.jpgThe 2009 SMT/Hybrid/Packaging show did take place in the Nuremberg trade show center from May 5 to 7. The show is Europe’s no.1 special interest event for System Integration in Micro Electronics. From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products.

The SMT/Hybrid/Packaging is since years a forum for the industry. Among other things the show presents the latest trends and developments as well as up-to-date solutions. The international show with more than 500 exhibitors had over 25.000 visitors form over 50 countries.
The focus of this years show was the manufacturing of electronic components on flexible printed circuit boards.

The EMS focus was highlighted at the VDI/VDE-IT joint booth in Hall 6, demonstrating the innovative approaches for PCB development as a basis for complex electronic systems. The fast development in the communications technology is driving towards miniturization and embedded compontents leading to more integrated PCBs.

The results in short:
26.500 sqm exhibition space
553 exhibitors + 38 represented companies
Apprx. 22.000 trade visitors
335 conference attendees

Find more info at:
www.mesago-online.de/en/SMT/main.htm
www.smt-exhibition.com

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